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According to DC's latest report, smartphones and tablets have become the main driving force for the growth of the global electronics industry in the past two years. It is predicted that the total shipment of global smartphones will exceed functional phones for the first time in 2013, reaching 918.6 million units. Among them, China's smartphone shipments are expected to be about 312 million units, and continue to occupy the position of the largest producer of smart phones, accounting for 32.8% of the global market share.
In the current production process of more and more smart phones and tablets, with the rapid development of technology and the demand for smart phones and tablet products to become more versatile, lighter and more reliable, many Electronic manufacturers are trying to make printed circuit boards (PCBs) smaller and lighter. The main feature is that the PCB begins to appear as a Step board (also known as a 3D board or an Embedded board); at the same time, in order to achieve more functions in the same space, components have become more compact, and 0201 components are widely used. 01005 components are being introduced into mainstream applications; in addition, more flip-chips are also used in modules.
These PCB manufacturing techniques and innovations in manufacturing processes have placed higher demands on all aspects of SMT manufacturing. In this regard, Vincent Goh, Business Manager of OK International Asia, said that the ultra-small chip components that are difficult to see with the naked eye, as well as the mass production and placement process of shaped metal shields and connectors, require strict requirements for production equipment. : Must be able to achieve high-speed placement, precision, flawless, fast replacement of production products and near zero error rate. For processing manufacturers, increasing production capacity and reducing defect rate are profits. When purchasing equipment, manufacturers should integrate into an SMT production line that meets their production needs according to the individual functions and advantages of each equipment to obtain the best overall. Investment income (ROI).
Guarantee PCB surface mount quality
“For the manufacture of the Step board (3D board), the main challenge lies in the solder paste printing technology. This is because the PCB is no longer a flat surface, so how to ensure the quality of different heights of printed solder paste points will be a difficult point,†ASM Advanced Assembly Zhu Jie, product marketing manager of System Co., Ltd. further analyzed, “The second is the patch process. Due to the unevenness of the PCB, the height of the patch will also change, which will easily lead to quality problems such as crushing or misalignment of components. Flip-chips also add to the SMT patch process, requiring a special wafer to provide the system, which in turn affects the reclaiming and placement."
In solder paste printing technology, in order to overcome the difficulties of micro-package and higher component density substrate design, a current trend is that solder paste printing technology is gradually replacing the traditional stencil printing technology. The Swedish-based MICROnic Mydata company is at the forefront of the development of solder paste printing technology. With the company's solder paste printing technology, the solder paste dosage and shape of each solder joint can be individually set and optimized. The quality of solder joints can also eliminate the problem of QFN lead-free components flying high and low soldering. In the processing of a large number of component package (PoP) manufacturing processes, it can improve the yield rate and ensure the production of complex PCB placement. high efficiency.
According to the person in charge of Mydata, in the current situation, although there is still a certain market space for stencil printing technology, for some special applications (such as QFN packaging, through-hole reflow soldering, PoP packaging, flexible substrates, etc.) One technique has encountered a processing bottleneck in the solder paste coating process. Especially in the consumer electronics industry, the current three major trends are actively promoting the development of non-template solder paste printing technology: first, requiring faster response time; second, the need for perfect solder joint quality, and strive to achieve zero rework; The third is the increasingly complex circuit board design for miniaturization and mobile electronic devices. It is reported that since Mydata established Meide Surface Mount Technology (Shanghai) Co., Ltd. in Shanghai in 2009, the company has maintained a high growth rate in overall performance in mainland China. At the end of last year, Mydata added a new branch in Shenzhen to further strengthen Its investment in electronics manufacturing in South China.
In the step board (3D board) patch process, ASM advanced assembly uses patch pressure control technology, through which the PCB can automatically sense the bumps of the PCB, and with the set pressure feedback value, it can be known whether the patch component has The surface of the PCB is reached; without this system, the component is easily crushed or thrown empty. In flip chip processing, ASM Advanced Assembly also provides a professional wafer feeding system. By adding a specially designed reclaiming chip head, the flip chip can be flip-chip mounted on the PCB accurately.
February 16, 2020