The mobile phone market, which produces more than 1 billion mobile phones annually, has become the most competitive field in the semiconductor industry. It has always been said that special processes such as gallium arsenide (GaAs), laterally diffused MOS (LDMOS) or silicon germanium (SiGe) bipolar CMOS (BiCMOS) can provide manufacturers and designs with less sophisticated geometric accuracy The short-term cost advantage and linear modulation required by the division. However, the inherent economies of scale in CMOS have driven the industry to invest heavily in it, so its scale has been and will continue to be ahead of other process products. For example, earlier transceiver modules manufactured by suppliers such as Infineon, NXP, and Skyworks using specialized BiCMOS processes have been implemented in CMOS for a long time, and in some cases, they have been integrated into system-on-chips. Inside the main processor of the phone. Designers have repeatedly found that although demanding processes may bring challenges in circuit modules, from a long-term perspective, implementing analog modules with standard CMOS will pay off. However, CMOS technology has not been able to successfully enter the field of power amplifier (PA) modules, and the power amplifier is a key component in mobile phones. Until now, the development of PA has been achieved using a special GaAs or LDMOS process coupled with hybrid module packaging technology. Overall, it is a costly manufacturing process, which makes PA occupy a large part of the cost of mobile phones. Power amplifiers require special semiconductor processes that can provide high breakdown voltage, high gain, and high-frequency transistor components. Hybrid packaging technology provides high-Q passive devices to generate 50Ω matching circuits. The use of standard CMOS to implement PA means that designers must face the situation of no enhancement transistors and high-Q passive devices, making the development of fully integrated PAs extremely challenging. A new technology has recently emerged that makes it possible to manufacture PAs using CMOS processes, so that PAs can be placed in a simple plastic package. Distributed Active Transformer (DAT) technology, as it is called, its geometry supports the use of semiconductor metals with relatively low Q values ​​to provide transformer-based matching circuits, thereby eliminating the need for module packaging. Distribute the PA core into several blocks, and then use the transformer structure to integrate the Power Supply and many other patented technologies to eliminate high breakdown voltage transistors. Figure 1: DAT-based CMOS power amplifier technology is used in stand-alone GPRS mobile phones. The invention of DAT technology is based on the research results of California Institute of Technology. Axiom Microdevices has further improved this technology, realized the commercial production of DAT PA, and improved the commercialization of General Packet Radio Service (GPRS) PA devices to solve problems such as receiving noise and high-voltage batteries Specific application issues such as work under the group. Unlike GaAs and other products, because the power core is implemented in CMOS, the small signal control circuit required to bias and adjust the GPRS type PA power can be integrated in the same bare chip as the main power stage circuit, thereby further reducing costs. The integration of the PA core also provides greater flexibility to support linear modulation schemes. Traditionally, designers have used one of the following two methods: one is the “forced method†using a linear modulator and PA; the other is a more advanced “envelope reconstruction†method, in which the nonlinear and efficient PA Become the core of the polarization modulator. For the latter method, the use of traditional PA construction technology will bring serious challenges. For example, the response of a PA core implemented with a special process to temperature and process changes is different from a linearized circuit. This situation usually leads to extremely unreasonable requirements, that is, the end user or mobile phone manufacturer must increase the factory calibration time to compensate, thereby increasing costs. On the contrary, if the PA core and its controller are integrated on the same die, it will provide multi-point access for monitoring or control incentives. In this way, when the designer develops the transmission architecture with the best performance and cost structure, there will be more choices. The next expected development is the further integration of the PA with other components in the mobile phone, such as the baseband and transceiver modules already implemented using CMOS technology. It can be seen from the Axiom AX502 devices shipped in large quantities that it is feasible to use DAT-based CMOS power amplifier technology in a separate GPRS product. It also has the possibility of further integration, thereby helping the industry continue to meet the needs of manufacturers and designers for smaller and more cost-effective chipsets and provide more functions.
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For this item, followed are the Features:
1. Universal AC input/Full range
2. Protection: Short circuit/Overload/Over Voltage
3. Cooling by free air convection
4. 100% full load burn-in test with 3-5 hours
5. No load power consumption < 0.5W
6. High efficiency, long life and high reliability
7. One year warranty
June 23, 2020