Do you know what is ENEPIG in PCB?
7.Process costs substantially lower than electrolytic nickel gold or electroless nickel electroless gold
ENEPIG PCB,Aluminum PCB,Rigid PCB,Flexible PCB Storm Circuit Technology Ltd , http://www.stormpcb.com
1. The original bidding announcement “II. Qualification of Suppliers†“4. The qualification requirements of the project manager are the second-level and above construction engineers who have been registered in the relevant profession, and must be the staff of the unit, and there must be no construction in progressâ€. “4. The qualification requirements of the project manager are the second-level or above construction engineer or the third-level project manager registered by the relevant professional, and must be the staff of the unit, and there must be no construction in progressâ€;
2. The first bidding section of the “2. The content of the bidding project†in the original bidding announcement “1. The content of the bidding project†is now changed to “the first bidding section: Changjiang Road, the model year, the Yangtze River Road parking, Hefei TV Station, Jinchuan Building, The lighting of the Silian Building"
3. The following lamps must be carried with samples: LED digital tube JH-80, LED point light source CL-DL-R193EF, concentrated spotlight PHB08, wall washer Qj64, please contact the purchasing center for detailed drawings;
4. The rest of the matter remains unchanged.
contact method:
Unit: Hefei Municipal Government Procurement Center
Bank: Huishang Bank Gulou Branch Account No. 0078 082 Company Name: Hefei Municipal Government Procurement Center Contact: Fan Lijun Tel: 0551-2692062 E-mail: Fax: 0551-2692101 Postal Code: 230001 Address: Jiushiqiao Street, Hefei City 3rd floor, No. 45 Xingtai Building 
What is ENEPIG?ENEPIG-Electroless Nickel Electroless Palladium Immersion Gold is a surface finish for Printed Circuit Boards.ENEPIG works well with lead free and conventional eutectic solder alloys.This is the best way for gold wire bonding. Advantages for ENEPIG:
1.[Black Nickel" free – no possibility of grain boundary corrosion of nickel surface by immersion gold
2.Palladium acts as an additional barrier layer to further reduce copper diffusion to surface, thus ensuring good solderability
3.Palladium completely dissolves into solder, without leaving an excessively high P% rich interface, exposing an oxide-free nickel surface allowing reliable formation of Ni/Sn intermetallic
5.Withstands multiple lead-free reflow soldering cycles
6.Demonstrates excellent gold wire bondability
Title: Lighting Lighting Project (including LED) Tender Project Change Letter Tender No.: 2009CGLZ0203 Announcement Date: March 11, 2009 Deadline: March 12, 2009 Tendering Agency: Hefei City, Yanyang District Landscape Rehabilitation Office: Anhui Province-Hefei City Content: Received the notice from the owner, and now makes the following changes to the "Hefei Xiangyang District Lighting Lighting Project" project (project number: 2009CGLZ0203):
February 24, 2019