In order to get a high-power LED device, it is necessary to prepare a suitable high-power LED chip . The international methods for manufacturing high-power LED chips are as follows:
1 large size method. By increasing the effective light-emitting area and size of the individual LEDs, the current flowing through the TCL layer is evenly distributed to achieve the desired luminous flux. However, simply increasing the light-emitting area does not solve the heat dissipation problem and the light-emitting problem, and does not achieve the expected luminous flux and practical application effects.
2 矽 floor flip method. Firstly, a large-sized LED chip suitable for eutectic soldering is prepared, and a corresponding size ruthenium substrate is prepared, and a gold conductive layer for eutectic soldering and a conductive layer (ultrasonic gold wire ball joint) are formed on the ruthenium substrate. Then, the eutectic soldering equipment is used to solder the large-sized LED chip to the crucible bottom plate. This kind of structure is more reasonable, considering both the light-emitting problem and the heat-dissipation problem, which is the current mainstream high-power LED production method.
In 2001, Lumileds developed the AlGaInN power flip-chip (FCLED) structure. The manufacturing process is: firstly deposit a NiAu layer with a thickness greater than 500A on the P-type GaN on top of the epitaxial wafer for ohmic contact and back. Reflection; then using a mask to selectively etch away the P-type layer and the multi-quantum well active layer, exposing the N-type layer; forming and etching to form an N-type ohmic contact layer, the chip size is 1 mm × 1 mm, P-type ohmic contact In the square shape, the N-type ohmic contact is inserted into the comb shape, which shortens the current spreading distance and minimizes the expansion resistance. Then, the metal bumped AlGaInN chip is flip-chip bonded to the antistatic protection diode (ESD). On the carrier.
3 ceramic floor flip method. Firstly, an LED chip with a large light-emitting area suitable for the eutectic soldering electrode structure and a corresponding ceramic substrate are prepared by using a common device of the LED chip, and a eutectic soldering conductive layer and a conductive layer are formed on the ceramic substrate, and then the eutectic solder is used. The device solders large LED chips to the ceramic backplane. Such a structure not only considers the light-emitting problem but also the heat-dissipation problem, and the ceramic bottom plate is a high-heat-conducting ceramic plate, the heat dissipation effect is very ideal, and the price is relatively low, so it is a suitable floor material at present, and can be used for the future. The integrated circuit is integrated into the reserved space.
4 sapphire substrate transition method. After the PN junction is grown on the sapphire substrate according to the conventional InGaN chip fabrication method, the sapphire substrate is cut away, and then the conventional quaternary material is connected to fabricate a large-sized blue LED chip having the upper and lower electrode structures.
5AlGaInN tantalum carbide (SiC) back light extraction method. CREE is the only manufacturer in the world to manufacture AlGaInN ultra-high brightness LEDs using SiC substrate. The structure of AlGaInN/SiCa chips produced in recent years has been continuously improved and the brightness has been continuously improved. Since the P-type and N-type electrodes are respectively located at the bottom and the top of the chip, single-wire bonding is adopted, which has good compatibility and convenient use, and thus becomes another mainstream product of the development of AlGaInNLED.

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Yixing Futao Metal Structural Unit Co. Ltd. is com manded of Jiangsu Futao Group.

It is located in the beach of scenic and rich Taihu Yixing with good transport service.
The company is well equipped with advanced manufacturing facilities.
We own a large-sized numerical control hydraulic pressure folding machine with once folding length 16,000mm and the thickness 2-25mm.
We also equipped with a series of numerical control conveyor systems of flattening, cutting, folding and auto-welding, we could manufacture all kinds of steel poles and steel towers.
Our main products: high & medium mast lighting, road lighting, power poles, sight lamps, courtyard lamps, lawn lamps, traffic signal poles, monitor poles, microwave communication poles, etc. Our manufacturing process has been ISO9001 certified and we were honored with the title of the AAA grade certificate of goodwill"
Presently 95% of our products are far exported to Europe, America, Middle East, and Southeast Asia, and have enjoyed great reputation from our customers,
So we know the demand of different countries and different customers.
We are greatly honored to invite you to visit our factory and cheerfully look forward to cooperating with you.

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