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The LED can be divided into two components, which are fixed on two parallel wires, and the resin is sealed into a bullet type, and the LED component is directly fixed on the printed wire substrate, and then sealed with a resin to form a surface package type.
The shell-type resin seal does not have the lens function, and it is easy to control the light collection and bundling. The surface mount type directly fixes the LED component on the substrate, which is suitable for high-density packaging, although it is small, lightweight, and thin, but the brightness is good. It is lower than the bullet type, and it is necessary to use a reflector to achieve high brightness requirements; the surface package type is mainly used in the fields of illumination and backlight modules of liquid crystal displays.
This article will focus on surface-mount LEDs, introduce the characteristics and functions required for surface-mount substrates, and the heat-dissipation problems often encountered in design. Also explore the optical design techniques of O 2 PERA (Optimized OutPut by Efficient Reflection Angle).
Package substrate function
Surface mount type LED chips typically only about grain size, a basic structure as shown in FIG. 1, which is a light emitting device package electrodes on the printed circuit board, and then coated with resin sealing.
One of the functions of the printed circuit board when manufacturing the LED chip is to componentize the semiconductor device, and another function is to make the emitted light generated by the component highly reflective in front, thereby improving the efficiency of the LED.
In order to improve the luminous efficiency of the LED module, high-efficiency reflection of light emitted from the substrate side is also very important, so a substrate having high reflectance is required. Gold plating or silver plating on printed substrates can improve reflectivity. However, when gold plating is used, the reflectance of low-wavelength light in the blue field is low, and the long-term durability is low when silver plating. Therefore, the researchers reviewed the use of white substrates for LEDs.
The white substrate for LEDs requires 400~750nm. The visible light has a uniform high reflectivity in the whole wavelength field. When the wavelength dependence of the reflectivity is very strong, the LED chip design will become a light source with a different design wavelength. The illuminating full-wavelength field has a uniform reflectivity.
September 05, 2019