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At present, the attention of LED companies to flip-chip technology has reached an unprecedented height. At the same time, many packaging manufacturers have begun to enter the production line of flip-chip products. The new integrated module of GP-50WW3-P46T-Z3TC, which was newly developed by Guangmai Electronics, is a representative product with flip chip as the main component.
"Compared to the package form of the front and vertical packages, the flip chip eliminates the need for wire bonding." Li Feng, chief engineer of Guangmai Electronics, told reporters that the integrated module uses flip-chip technology, which not only eliminates the product processing process, but also eliminates the product processing process. It also reduces the production cost of the product.
In addition, this integrated module also uses DPC technology to better adapt to flip chip by solving the problem of the flatness and line width of the ceramic substrate. "The biggest advantage of this technology is that it can solve the problem of bubble gap between the substrate and the chip electrode contact layer when the flip chip eutectic is solved in the process." Li Feng told reporters that Guangmai Electronics has also developed a matching plastic gland. It is used to solve the problem that the basic locking screw of the ceramic is fragile.
"The integrated module of GP-50WW3-P46T-Z3TC model has the same ratio of light-emitting area and fixed aperture to the conventional integrated module, so it can smoothly replace the traditional integrated module." Li Feng also told reporters that due to this integration The module uses a ceramic substrate, so it has the characteristics of low thermal resistance and high light efficiency, which can minimize the quality problems caused by heat dissipation and prolong the service life of the module.
Since its inception, Guangmai Electronics has been committed to the research of a new generation of ceramic light source and module light source. At the same time, it has continued to focus on the improvement of the heat dissipation, light efficiency and the photoelectric parameters of the light source, and strive to win customers with technology and quality. It is reported that the integration module of Guangmai Electronics to participate in the high-tech LED lighting exhibition has been declared relevant industry patents.
"This module product is showing a rapid growth after the launch of this year." Li Feng told reporters that the product has achieved good sales since its launch and has been widely recognized by customers at home and abroad. 
[Text|High-tech LED reporter Xu Chaopeng] High-profile LED industry event--2014 Gaogong LED Lighting Exhibition will be held at the Guangzhou Pazhou Canton Fair Complex on September 26-28, Shenzhen Guangmai Electronics Co., Ltd. The following is referred to as “Guangmai Electronicsâ€. The new integrated module model GP-50WW3-P46T-Z3TC will be exhibited at the exhibition. The light efficiency of this product is 120lm/w and the thermal resistance is 0.6°C/w. Domestic leading level.
October 03, 2020