Remotely command the robot and the robot arm to enter the inside of the electrical equipment for cleaning. Have you seen such a scene? On December 6th, the reporter saw in Chongqing Dijon Power Saving Technology Co., Ltd.: a compact crawler-type cleaning robot that enters the central air-conditioning duct and small equipment space for flexible detection, sampling and cleaning; the remote control arm is visualized. It can clean parts such as equipment gaps that people cannot reach. “Electrical equipment will absorb a large amount of dust and metal particles, which will cause electrical conductivity and lead to poor heat dissipation, which will affect performance and parameters.†Pan Guiyuan, head of Diligence and Power Saving Technology, introduced large electrical appliances, motors, mobile communications, CNC machine tools. The more precise and complex the structure, the higher the requirements for the technology and effect of cleaning and maintenance. In this context, Diligence and Power Saving Technology successfully developed new technologies such as evaporator waterless cleaning device and long distance charging cleaning technology through technical breakthroughs, and obtained more than 30 national patents. The company is currently providing related services to large units such as Cuntan Port and Orchard Port and some foreign-funded enterprises. The company also introduced a free-disassembly car air-conditioning cleaning service that enables deep cleaning of car air conditioners without disassembling the car. This technology greatly reduces the difficulty of cleaning traditional automotive air conditioners and has great advantages in terms of cost and convenience. Recently, many 4S stores have come to the thrifty and energy-saving technology to "take the classics" and are ready to adopt this new technology. (Reporter Bai Lin) HDI PCB Specification
High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design is able to incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.
The HDI PCBs we offer include the following highly requested characteristics:
Applications
HDI PCB is used to reduce size and weight, as well as to enhance electrical performance of the device. HDI PCB is the best alternative to high layer-count and expensive standard laminate or sequentially laminated boards. HDI incorporate blind and buried vias that help to save PCB real estate by allowing features and lines to be designed above or below them without making a connection. Many of today's fine pitch BGA and flip-chip component footprints do not allow for running traces between the BGA pads. Blind and buried vias will only connect layers requiring connections in that area.
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HDI PCBs are characterized by high-density attributes including laser microvias, fine lines and high performance thin materials. This increased density enables more functions per unit area. Higher technology HDI PCBs have multiple layers of copper filled stacked microvias (Advanced HDI PCBs) which creates a structure that enables even more complex interconnections. These very complex structures provide the necessary routing solutions for today's large pin-count chips utilized in mobile devices and other high technology products.
Blind and/or buried vias
Via-in-pad
Through vias from surface to surface
20 µm circuit geometries
30 µm dielectric layers
50 µm laser vias
125 µm bump pitch processing
September 23, 2021