Molex Announces Next Generation CMX Connector Series

Photocoupler

Molex, a global leader in interconnect solutions, has launched its second-generation sealed, hybrid, high-density, modular connector family based on the successful CMC connection system. This new CMX series is fully protected and features a hermetically sealed CTX terminal design that delivers superior sealing performance. Ideal for powertrain applications in the transportation industry—such as engine control units, automatic transmissions, suspension controls, and electric parking brakes—the CMX connectors are built to withstand harsh environments.

Salvin Williams, Global Product Manager at Molex, stated: "The next-gen CMX connector family builds upon Molex’s 10-year-old CMC product line, offering significant performance improvements while maintaining cost efficiency. All new CMX connectors are available, and what makes them unique is their complex interface seal protection design, which ensures the connector remains protected before, during, and after disconnection."

The initial two circuit sizes of the CMX series include compact 5-5/55-circuit and 5-row/65-circuit connectors, specifically designed to meet the needs of the transportation market. Additional connectors with various circuit configurations are currently in development, expanding the flexibility and application range of the CMX family.

These CMX connectors utilize CTX terminals in two sizes—0.635mm (0.025") for low-current applications and 1.50mm (0.059") for medium-current use. The new porous seal technology enhances the sealing performance of the CTX terminals, ensuring reliable connectivity even under extreme conditions. The terminals also support ISO and ASO cable sharing, making them versatile for different system designs.

The CTX terminal system is designed with a solid-clear structure, making it suitable for small, medium, and high-current applications in challenging environments. It uses high-conductivity copper alloys to ensure excellent stress relief and current delivery capabilities. Additionally, the sealed back cover can be molded with a frangible dummy plug, helping device manufacturers reduce integration time and application costs. This feature also provides greater flexibility for customers who may not use all terminal cavities.