As we all know, the "central nerve" of pure electric vehicles - the motor controller, controls the start, run, advance and retreat, speed, stop of the electric motor, and is also the core control device of other electronic devices. The current sensor is directly related to its performance.

The BLX9-200I0V1HA equipped with BYD pure electric vehicle E6 and the BSX9-600IOV1HA current sensor equipped by BYD Daimler joint venture brand Tengshi are independently developed and designed by Shenzhen BYD Microelectronics Co., Ltd., and the program has obtained national patent (ZL201220429774 .2).

The current sensor is based on ASIC technology with a highly integrated design and a multi-conductor current sensor solution. This solution breaks the conventional way of requiring three sensors and adopts integrated design, which is the first in China.

Compared with conventional solutions, BYD's current sensor solution integrates Hall chip, operational amplifier, filtering and temperature compensation into a single chip, resulting in higher reliability and lower failure rate.


Compared with the traditional assembly method, it is stronger and more stable, and fully meets the demanding requirements of various road conditions for automotive electronic devices.

At the same time, the BYD current sensor solution only needs a single 5V power supply, which effectively reduces the system energy consumption; the integrated integrated design makes the electronic device smaller and saves space.

According to the latest data, the accumulated mileage of BYD pure electric vehicle E6 has exceeded 160 million kilometers, and the mileage of bicycles has exceeded 500,000 kilometers. These figures are the best proof of the excellent performance of BYD high integrated integrated current sensor products.

Shenzhen BYD Microelectronics Co., Ltd., a semiconductor division of BYD Co., Ltd., was established in October 2004. It was formerly known as BYD's IC design department, which mainly supports the strategic development plan of the Group's vertical integration.

Since the establishment of the company, it has been committed to the development of lithium battery protection chips and power MOSFETs, and has developed power semiconductor devices, IGBT power modules, power management ICs, CMOS image sensors, touch control ICs, MCUs and audio and video processing ICs. A variety of product lines, applications covering the sensing, processing and control of optical, electrical, magnetic and acoustic signals, can be applied to many fields of automotive, energy, industrial, communications and consumer electronics. BYD's microelectronics semiconductor business covers a wide range of applications, and is very rare in China and even the world. The company's own 6-inch wafer factory and surface mount packaging factory, vertical integration strength is also rare in China.

(This article is a BYD submission)

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